Diamond Wafering Blades – Precision Cutting for Hard Materials

UKAM's Diamond Wafering Blades are designed for precise, efficient cutting of brittle materials such as ceramics, semiconductors, and composites. Engineered for minimal kerf loss and superior edge quality, these blades provide excellent durability and accuracy in laboratory and industrial settings. Ideal for sectioning delicate samples, they ensure smooth, controlled cuts with reduced chipping.